| 摘要 |
PURPOSE:To prevent the occurrence of cracks or peeling so as to improve reliability even at temperature change or thermal stress application by patterning photosensitive resin at the surface of the lead frame sealed with resin. CONSTITUTION:Photosensitive resin is applied on the surface of a lead frame 3, and it is subjected to exposure, development, and baking to make a photosensitive resin film 6, which has the shape of a pattern. A semiconductor element 2 is die-bonded to the island part of the lead frame gotten, using silver paste, and an electrode is bonded by a gold wire 4, and then it is sealed with epoxy resin 1. Hereby, the adhesion between the resin for sealing and the lead frame 3 becomes excellent, and the occurrence of cracks or peeling can be prevented at temperature change or heat stress application in mounting of the device, and further the breakdown of the semiconductor element by the penetration of moisture can be prevented. |
