发明名称 METHOD FOR MANUFACTURING METAL CORE PRINTED CIRCUIT BOARDS
摘要 20365-2887 A method for the manufacturing of a metal core pc board which provides for manufacturing of two or three dimensional metal core pc boards of any form with or without throughplating. The manufacturing of such pc boards can occur by injection molding, injection/compressing molding or by a pressing method. High-heat resistant theremoplastics, as well as duroplastics are preferably employed as pc board materials. A metal with good thermal conductibility is used for the core. The material is selected such that the thermal expansion coefficients of the metal core and the pc board material are optimally equal. The manufacturing contains the following steps: lamination of the metal plate with a plastic foil on one or both sides; introduction of the desired hole pattern with a corresponding over dimension into the laminated metal plate; placing of such prepared metal core in an injection molding tool: and thermoforming the plastic on the laminated core over the plastic foil and simultaneously filling out the holes to a final dimension with the plastic.
申请公布号 CA1303243(C) 申请公布日期 1992.06.09
申请号 CA19890587646 申请日期 1989.01.06
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 HADWIGER, HELMUT;SCHMIDT, HANS F.
分类号 B32B15/08;H05K1/00;H05K1/05;H05K3/38;H05K3/44 主分类号 B32B15/08
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