| 摘要 |
A tape automated bonding (TAB) frame and a process for testing the same. The frame is designed to receive a die, an integrated chip or other similar components having output leads. The frame generally comprises a relatively thin film of dielectric material, a pattern of substantially adjacent inner lead bonds, a pattern of substantially adjacent outer lead bonds for providing input/output ports to the die, and a pattern of substantilly adjacent probe points for providing test points to the frame and the die thereon. A generally flat and rigid plate is mounted on a prober for supporting both a cut-out portion of the frame and the die thereon. The testing process includes the steps of excising the die from the frame in the form of a coupon, such that the coupon contains the pattern of scrap probe points on the TAB frame and the die; placing the excised coupon onto the prober; aligning the coupon; and testing the coupon and the die. |
