| 摘要 |
A carrier for use in flexible circuits and tapeautomated-bonding including a layer of dimensionally stable polyimide film; a layer of metallic chromium vapor-deposited on said polyimide; a layer of copper vapor-deposited on said chromium layer; and a layer of copper electro-deposited on said vapor-deposited copper layer. The chromium deposited on the polyimide affords resistance to undercutting from gold and tin plating baths, and allows conductor to be deposited on both sides of the polyimide. |
