| 摘要 |
PURPOSE:To prevent defects of a soldered part by pressing a heated semiconductor element on a tie bonding part against molten solder, vibrating and separating from the solder the element, and pressing against the solder and vibrating the element. CONSTITUTION:A ceramics package 2 is mounted on the upper face of a heat block 1 heated to 330 deg.C and heated for the specified time and then solder foil 7 is mounted on the tie bonding part 2a and molten. N2 gas heated to 300 deg.C is blown to the part 2a at 4l/min. through a nozzle 6 and a chip 3 is sucked by vacuum suction to the lower face of a suction collet 4 heated to 300 deg.C by a heater 5. While lowered and pressed against molten solder 8, the collet 4 is scrubbed by 5-10 seconds' reciprocation on a horizontal face and lifted to separate part of the chip 3 from the solder 8. While the collet 4 is lowered again and the chip 3 is pressed against the solder 8, the collet 4 is scrubbed for 5-10 seconds to decrease the percent defective of the soldered part. |
