发明名称 Coating composition
摘要 The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.
申请公布号 US5120578(A) 申请公布日期 1992.06.09
申请号 US19910737352 申请日期 1991.07.29
申请人 SHIPLEY COMPANY INC. 发明人 CHEN, JENSHENG;KNUDSEN, PHILIP D.
分类号 C23C18/30;H05K3/18;H05K3/38 主分类号 C23C18/30
代理机构 代理人
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