METHOD OF PERFORMING METAL COATING ON METALLIZED SURFACES OF ELECTRONIC COMPONENT CHIPS WITH AN ELECTRONIC COMPONENT CHIP HOLDER

摘要

An electronic component chip holder employed for coating metallized surfaces on both longitudinal ends of a plurality of electronic component chips with a metal such as solder, while holding the same. The holder comprises a plurality of holding portions for holding the electronic component chips one by one. Each of the holding portions is defined by a through hole, and each of the electronic component chips is inserted in the holding so as to be longitudinally aligned with the axis of the through hole. An elastic member is formed on an inner peripheral surface defining each holding portion, to elastically hold a longitudinal intermediate portion of each electronic component chip. A plurality of electronic component chips thus held by the holder are collectively dipped in a molten bath of a metal such as solder, so that coating films of such a metal are formed on the metallized surfaces.