发明名称 HEAT CONTROL MECHANISM FOR ELECTRONIC DEVICE MOUNTED ON ARTIFICIAL SATELLITE AND SPACECRAFT
摘要 PURPOSE:To high-efficiently diffuse a quantity of heat generated by an electronic part and to prevent overheating of the electronic part by embedding a heat pipe in a heat sink mounted on the base member of an artificial satellite and securely adhering a circuit substrate, on which an electronic part is mounted, to the heat sink. CONSTITUTION:When a heat control mechanism for an electronic device mounted on an artificial satellite and a spacecraft is applied to a power amplifier mounted on a communication satellite, a base member 4 is composed by a relay panel, and heat generated by an electronic part 1 is emitted in a space through the base member 4. The electronic part 1 is mounted on an electronic circuit substrate 6 through a heat carrier 5 formed of a heat good conductor, and the substrate 6 is securely adhered to the bottom of a casing 7 through a trapezoidal heat sink 3 having an extremely high volume of heat. A heat pipe 2 is embedded in the vicinity of the electronic circuit substrate 6 in the heat sink 3, heat generated by the electronic part 1 is transmitted to a heat pipe 2 through a heat carrier 5 and the electronic circuit substrate 6. The heat is diffused in an axial direction (vertically to a diagram paper) through isoentropic operation of a heat pipe.
申请公布号 JPH04163299(A) 申请公布日期 1992.06.08
申请号 JP19900287195 申请日期 1990.10.26
申请人 HITACHI LTD;UCHIYUU TSUUSHIN KISO GIJIYUTSU KENKIYUUSHIYO:KK 发明人 MAEDA TOSHIHIDE;IWAI SEIKOU;ISO AKIO;SEKINE KENJI
分类号 B64G1/50;B64G1/66 主分类号 B64G1/50
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