| 摘要 |
PURPOSE:To facilitate optimum and efficient flux application by providing plural nozzles freely movable in the transverse direction of a plate to be soldered and providing these nozzles freely movably in the directions apart and near from and to the plate to be soldered. CONSTITUTION:Fluxes F sprayed from the nozzles 53, 54 are blown to the plate W to be soldered under transportation to coat the plate with the fluxes. The nozzles are adjusted in the spacing therebetween according to the width size of the plate to be soldered and are provided freely movably in the directions apart and near from and to the plate to be soldered. The size of the flux applying patterns is changed by adjusting the height of the nozzles if these patterns blown from the nozzles to the plate to be soldered are not adequate at this time. The efficient and optimum flux application is executed according to the width size of the plate to be soldered in this way and the contamination of means for transporting the plate to be soldered, etc., is lessened; in addition, the efficiency of recovering the flux is improved as well. |
