| 摘要 |
PURPOSE:To make the developing rate of a photoresist film inside the face of a wafer nearly uniform and to form a photoresist pattern over the whole region on the face of the wafer with good dimensional uniformity by making two or more holes through which a developing solution is dropped by its own weight before the developing solution is discharged. CONSTITUTION:A semiconductor substrate is coated with a photoresist; said semiconductor substrate is exposed to light through a mask or a reticle on which a prescribed circuit pattern has been drawn; the exposed semiconductor substrate is developed. At this time, a developing nozzle, for a photoresist film, which discharges a developing solution is provided with at least two or more holes 2a through which the developing solution is dropped by its own weight. For example, a nozzle main body 1a is formed to be a funnel shape, and many holes 2a which discharge a developing solution are made. Thereby, since the developing solution is dropped simultaneously to the whole region of a wafer, the time during which the developing solution is spread over the face of the wafer does not differ sharply inside the face of the wafer and the developing rate of a photoresist film does not differ sharply inside the face of the wafer. |
