| 摘要 |
PURPOSE:To alleviate mounting limitations on a pad to be formed on the surface of a substrate to form the pad suited for high-density mounting by providing a second pad formed on a first pad and for erecting a lead on a conductive member of height enough to house a wire for the change of design or repair of substrate inside. CONSTITUTION:On the predetermined surface of a substrate 30 provided with an internal wiring 24 inside and having a VIA 32 for guiding the wiring 34 to the surface of the substrate 30, a lower pad 31 is formed by the use of a well-known method, and a conductive adhesive 35 having a predetermined height is formed on the surface of the lower pad. A laser light is applied to the surface of the conductive adhesive 35 hardened by heating so that a recessed member 35c is formed. Subsequently, a wire 37 for the repair of substrate or change of design is bonded to the part of the lower pad 31, of which the surface is exposed. The conductive adhesive 36 is again applied to the peak 35a of the recessed part 35c and a lead-mounting pad 38 is formed by the use of the peak 35a as a crosslink. Then, a lead 40 is erected on the surface of the lead- mounting pad 38 by soldering. Thus, a wire and lead can be formed on one pad. |
