| 摘要 |
PURPOSE:To make it possible to reduce design and development time for light emitting diodes at low cost and improve the brightness of said light emitting diodes by installing a light emitting diode chip on the tip of a lead frame on one side at the reflected side of a reflecting cup, electrically connecting the tip of said lead frame with the tip of a lead frame on the other side with a wire, and molding these lead frames, the light emitting chip and the wire with transparent resin. CONSTITUTION:A light emitting diode 1 is provided with a reflecting cup 5 made of high heat resistant organic resin into which two lead frames 3 and 4 installed in parallel at a span are inserted where a light emitting diode chip 6 is installed at the tip of the lead frame 3 on one side at a reflected side 5a of the reflecting cup 5 and this light emitting diode chip 6 is electrically connected with the tip of the lead frame 4 with a wire 7 stretched between the two locations. Furthermore, these lead frames 3 and 4, the light emitting diode 6, and the wire 7 are molded with transparent resin 8. |
