发明名称 PACKAGE FOR SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To cope with a reduced pad and an interval of pads, and to shorten a time required for a wire bonding by securing a connecting conductor made of an elastic conductor to a stitch. CONSTITUTION:A connecting conductor 1 is secured to a stitch 2 of internal terminals connected to external terminals 6 of a package body 3. The conductor 1 is made of an elastic conductor such as tungsten wire, and a protrusion 1a is provided at the end. The conductor 1 is press-bonded or welded to the stitch 2 similarly to the case of wire bonding. A semiconductor chip 5 is adhered to the rear surface of a cover 7 of the package, and mounted on the body 3 thereby to bring the protrusion of the end of the conductor 1 into pressure contact with the pad 4 to obtain a continuity therebetween. Thus, the reduced pad and the interval of the pads can be coped with, and a time required for wire bonding can be shortened.
申请公布号 JPH04162735(A) 申请公布日期 1992.06.08
申请号 JP19900289034 申请日期 1990.10.26
申请人 NEC IC MICROCOMPUT SYST LTD 发明人 KATO HIROYUKI
分类号 H01L21/60 主分类号 H01L21/60
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