| 摘要 |
<p>PURPOSE:To maintain the function, reduce the cost and downsize it by forming it in a double structure of transparent resin for performing photocoupling and envelope mold resin high in surface reflection factor. CONSTITUTION:A light emitting element 1 and a light receiving element 2 are arranged and fixed opposite on approximately the same plane of a lead frame 5, and the light emitting element 1 and the light receiving element 2 on the lead frame 5 are enclosed with transparent resin 3 consisting of silicon rein, and a light transmission path is formed by thermosetting. Next, envelope molding is performed with envelope resin 4 consisting of white epoxy resin high in surface reflection factor, and the light to become the means for transmission of signal issued from the light emitting element 1 is made to reach the light receiving element by the reflection effect of the envelope resin 4. And the shaping processing of a lead is performed. Hereby, the maintenance of the function, the reduction of cost, and the downsizing can be realized.</p> |
