| 摘要 |
PURPOSE:To perform stable action to a high frequency and easy replacement of an IC package by constituting an IC peripheral circuit on a small substrate, arranging a land in a position corresponding to an IC pin, and fixing the substrate and IC piled into press-contact. CONSTITUTION:A land 1a, corresponding to a lead 2a of an IC package 2, is formed in a small substrate 1, and a peripheral circuit 5 is formed in the periphery of the land. Here, the lead 2a of an IC and the land 1a of the small substrate 1 are brought into press contact by a protrusion part 3d of a cover 3b and a contact spring 3c to hold electrical connection. Further by matching shape of the small substrate 1 with an IC socket 3a, position alignment of the land 1a to the lead 2a is naturally performed. Thus by fixing the substrate 1 and the IC piled into press contact, the IC can be stably actuated to a high frequency region further to make replacement easily possible of the IC package 2. |
