| 摘要 |
PURPOSE:To provide many outer electrode pins by securing an insulating cap having holes in which outer electrode pins are passed and uniformly covering a bottom. CONSTITUTION:A ceramic cap 4 is sealed with sealing glass 5 in the bottom of a ceramic case 3. A semiconductor element 1 is placed at the center of the case 3 molded by laminating ceramics, and metal fine wirings 6 electrically connect electrode pads on the element 1 to inner electrodes on the case 3. A through hole 4a is provided so as to correspond to the position of an outer electrode pin 7 of the case 3 at the cap 4. If the glass 5 is printed on the cap 4, when the case 3 and the cap 4 are sealed, the hole 4a is blocked by the pin 7 and the glass 5, and hence hermetical sealability is held. Since the sealing width of the inside of the pin can be reduced, more pins can be provided in the same semiconductor device profile. |
