| 摘要 |
<p>PURPOSE:To reduce in thickness a package and to obtain the package having excellent thermal reliability after molding by allowing a coating agent to continuously exist from the surface of an element to partial surface of a lead frame, exposing wirings from the agent except parts, and setting a shortest distance from the profile of sealing resin to the element to a predetermined value. CONSTITUTION:An element 1 and a lead frame 2 are disposed oppositely at the sides thereof, and developed from the front surface of the element to the side of the frame 2. Coating agent 3 is introduced to a tie bar 2t through inner leads 2n thereamong. The coating thicknesses of the agent 3 on the surface of the element must be suppressed to a minimum limit by considering an effect of reducing in thickness a package, and is desired to 30-50mum capable of improving a circuit protection or adhesive strength of sealing resin 5 with the element 1. Since wirings 4 for electrically connecting the element 1 to the frame 2 are about 100mum at present even if a loop height hr at this time is minimum, the entire wirings are not covered with the agent so as to increase the effect.</p> |
