| 摘要 |
<p>PURPOSE:To obtain a rigid mounting strength by forming at least a part to be cut of outer leads thinly. CONSTITUTION:A lead part 6 not used as an outer lead 4 is thinned as compared with an effective part as the lead 4, and formed as a product through assembling - finishing steps. In this case, outer layer solder plating is performed at almost all parts of the end side faces 8 of the leads 4 to be mounted. Accordingly, a rigid mounting strength is obtained at the time of mounting the product.</p> |
