发明名称 BLATT MIT TRENNMITTEL FUER HOHLFORMEN UND VERFAHREN ZUM ZUFUEHREN DES TRENNMITTELS AUF DIE OBERFLAECHE EINER HOHLFORM MIT DIESEM BLATT.
摘要 A mold-releasing sheet comprising a composition containing an uncured rubber, a curing agent and a mold-releasing agent, and a method for applying a mold-releasing agent onto a mold using the sheet. The sheet is used to efficiently apply a mold-releasing agent onto a surface of a mold by cleaning after a molding step in a process for continuously producing semiconductor devices by continuously encapsulating semiconductor elements with an epoxy resin composition, etc., by a transfer molding.
申请公布号 DE3778667(D1) 申请公布日期 1992.06.04
申请号 DE19873778667 申请日期 1987.12.22
申请人 NITTO DENKO CORP., IBARAKI, OSAKA, JP 发明人 KITAURA, TOSHIHIKO C/O KYUSHU NITTO DENKO;NAKAMURA, AKIO C/O KYUSHU NITTO DENKO;SAKAMOTO, MASAYUKI C/O KYUSHU NITTO DENKO;TAKASHIMA, KOUICHI C/O KYUSHU NITTO DENKO;HIRAKAWA, KIYOTAKA C/O KYUSHU NITTO DENKO;MIZOTA, MATAO C/O KYUSHU NITTO DENKO, KANZAKI-GUN SAGA, JP
分类号 B29C33/58;B29C33/68;B29C33/72;C08K5/14;C08K5/3445;H01L21/56;(IPC1-7):B29C33/00 主分类号 B29C33/58
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