| 摘要 |
<p>PURPOSE:To prevent the generation of card thickness variations by providing a panel fixed to a frame with a stepped part on the front and rear surfaces through an adhesive layer, and positioning the top of a projecting part, with which the panel comes in contact at a higher level than the top of an IC. CONSTITUTION:A frame 11 with a projecting-shaped stepped part 12 on the front and rear surfaces is formed like a bottomed box as a whole, and stores an IC 13 inside and a mounted circuit substrate 14 on the front and rear surfaces. On both stepped parts 12 of the frame 11, U-shaped projecting parts 15, 16 which come in contact with the panel are provided in one piece. In addition, the top of the projecting parts 15, 16 is positioned at a higher level than the top of the IC 13. Further, a panel 17 which protects the IC 13 from an external impact is fixed to the frame 11 through an adhesive 18 of sheet-like thermally curable resin, and the IC protecting part 17a becomes warped, forming a recessed part on the surface of the panel due to the both projecting parts 15, 16 coming in contact with the panel 17.</p> |
