发明名称 IC CARD
摘要 <p>PURPOSE:To ensure that an external force does not act upon the first adhesive when an IC card is connected to an external device, and thereby eliminate the possibilities of distorting the outer shape of the card by fixing a panel to a frame with the first adhesive and further fixing a connector connected to a substrate with the second adhesive. CONSTITUTION:A frame 11 incorporating a circuit substrate 12 for IC mounting is formed entirely using a bottom box and a recessed part 13 for sheet storage which opens into the frame is provided. A metal panel 14 opposed to the circuit substrate 12 is fixed to the frame 11 with an adhesive sheet 15 as the first adhesive to protect IC's 16 on the front and rear of the circuit substrate 12 from an outer impact. A two-piece connector 17 connected to the circuit substrate 12 is provided inside the panel 14, and further, is fixed to the frame 11 with an adhesive sheet 18 as the second adhesive. Consequently, an external force which acts upon the connector 17 no longer works on the adhesive sheet 15 as the first adhesive during the connection of a connector to an outer device, as the connector 17 is connected to the frame 11 with the adhesive sheet 18 as the first adhesive.</p>
申请公布号 JPH04161392(A) 申请公布日期 1992.06.04
申请号 JP19900290441 申请日期 1990.10.25
申请人 RYODEN KASEI CO LTD;MITSUBISHI ELECTRIC CORP 发明人 KAMINAKA TAKESHI;MAEDA HAJIME;IKEDA YASUKI;TACHIKAWA TORU;ONODA SHIGEO
分类号 B42D15/10;G06K19/077;H01L25/04;H01L25/18;H05K7/14 主分类号 B42D15/10
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