| 摘要 |
<p>PURPOSE:To increase the mounting density of a memory LSI chip and thereby realize its large storage capacity by laminating memory LSI chips, stacking conductor leads connected to a common electrode to junction the leads to conductor wiring and at the same time, making the lengths between the centers of memory LSI chips and the other ends the same. CONSTITUTION:A large number of memory LSI chips 6 are mounted on a printed circuit board 2 with a specified area by laminating memory LSI chips 6, 6' to realize an IC memory card of large capacity. In addition, conductor leads 12, 12' connected to common electrodes 10, 10' are stacked over the other and these stacked leads 12, 12' are junctioned to conductor wiring 23. Subsequently, wiring space is reduced to realize the acceleration of signal transmission speed. In addition, the centers of the conductor leads are connected using insulating film 15 and the other ends of the leads are connected using insulating film 16. Further, the lengths between the centers 12b, 12'b of the leads and their other ends 12c, 12'c are made the same. Also a film carrier of the same shape is used on the first and the second stage and thus a highly reliable IC memory card is manufactured at low cost.</p> |
