| 摘要 |
<p>PURPOSE:To prevent the phenomena that an extraneous substance such as an adhesive of a sheet sticks to the rear side of a semiconductor chip and that the rear side is impaired, by moving a plurality of needles at a specified speed during the time from the contact of the fore ends of the needles with the sheet to the reaching thereof to the semiconductor chip. CONSTITUTION:A sheet 2 is supported by a mounter ring 1, while a wafer has been divided into separate semiconductor chips 3 through a dicing process. In this state, four needles 4 are thrust up from the rear side of the sheet 2 and the rear of the semiconductor chip 3 is thrust up by the needles 4 piercing the sheet 2, so that it be exfoliated from the sheet 2. When the needles 4 are made to approach the rear of the sheet 2 at a speed of about 1.0mm/sec., an impact of the needles 4 caused when they break through the sheet 2 and strike on the rear of the semiconductor 3 is small and, consequently, it is prevented that an extraneous substance such as adhesive of the sheet 2 sticks to the rear of the semiconductor chip 3 and that the rear thereof is impaired. An excellent result is obtained when the moving speed of the needles is 0.5 to 5mm/sec.</p> |
