| 摘要 |
<p>PURPOSE:To obtain a wafer replacing apparatus not staining of the process surfaces of wafers by providing a detector for discriminating between the surface and the rear of the wafer and an inverting mechanism for rotating the wafer at an angle of 180 degrees according to the discrimination of the detector by taking out the wafer from a cassette, discriminating between the surface and the rear of the wafer and by putting it in another cassette for accommodation. CONSTITUTION:A rod 6 of a pusher 1 rises, passes a through hole 5d of an empty cassette 5b and holes the end part of a wafer 8 with a pawl 1b. Next, a pawl 1a makes the wafer free, the rod 6 lowers, the wafer 8 stops in an area A of inversion, and motor 7c is rotated according to a determination signal stored, so as to rotate the wafer 8 at an angle of 180 deg.. Ten, the rod 6 lowers to insert the wafer 8 in the cassette 5b, and the wafer 8 is put on the groove bottom 5c and set free from the pawl 1b. Then, the rod 6 returns to the former position. Next, the rod 6 rises, the pawl 1b holds the wafer 8 and the rod 6 rises. Then, the pawl 1a takes hold of the other end part of the wafer 8, a detector 2a determines the surface and rear of the wafer 8, and the wafer is put in a second groove from the end of the cassette 5b for accommodation.</p> |
