| 摘要 |
<p>PURPOSE:To attain a high heat radiate power and high reliability by a method wherein a semiconductor element chip is supported from above and below by metal support plates and sealed with resin. CONSTITUTION:An element 10 is mounted on a lower-side support plate 17, a lead frame is superposed on the lower-side support plate 17 and the support plate 17 is fixed to an inner lead 11. Next, the inner lead 11 and an electrode on the element 10 are wire-bonded, and after a film 14 is stuck on the element 10, an upper-side support plate 16 is fixed to the inner lead 11. Lastly, an assembly thus prepared is sealed with resin. The heat generated in the element 10 flows very well to the support plates 16 and 17 and thus a heat-radiation property is improved remarkably. Besides, the plates have an effect that a thermal stress generated by the shrinkage of the resin 18 after molding is checked from acting directly on the element 10, and thus prevent the damage of the element 10.</p> |
