| 摘要 |
PURPOSE:To enable soldering to be tested by providing a binary test result signal output circuit which outputs a binary signal which is determined by a logic between an output signal of a selection circuit and that of a constant binary output signal output circuit to an output pin corresponding to a binary output signal of a constant binary output signal output circuit. CONSTITUTION:An output corresponding to an internal logic output of a semiconductor integrated circuit is set to a constant binary output signal by a constant binary output signal output circuit 14 regardless of the output signal of the related internal logic output. Then, an output pin of the semiconductor integrated circuit at a previous stage which is mounted at a printed-circuit board 4 is set to a high-output impedance state. A test signal or a test pattern signal is input to a probe point at each input on the printed-circuit board 4 where a wiring edge part to be bonded 2 is connected through a probe pin, for example, from an in-circuit tester. A test result signal which is determined by a constant binary output signal from the constant binary level output circuit 14 is output from a binary test result signal output circuit 26. |
