A METHOD OF MAKING A MULTILAYER THIN FILM STRUCTURE
摘要
A method of making a multilayer thin film structure on the surface of a dielectric substrate which includes the steps of: a) forming a multilayer thin film structure including the steps of: applying a first layer of dielectric polymeric material on the surface of a dielectric substrate, applying a second layer of dielectric polymeric material over the first layer of polymeric material wherein the second polymeric material is photosensitive, imagewise exposing and developing the second polymeric material to form a feature therein, the second layer feature in communication with at least one feature formed in the first polymeric material; and b) filling the features in the entire multilayer structure simultaneously with conductive material. Preferably, the first layer feature is a via and the second layer feature is a capture pad or wiring channel. Also disclosed is a multilayer thin film structure made by this method.
申请公布号
WO9209102(A1)
申请公布日期
1992.05.29
申请号
WO1991US00703
申请日期
1991.02.01
申请人
INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人
CHANG, KENNETH;CZORNYJ, GEORGE;FAROOQ, MUKTA, SHAJI;KUMAR, ANANDA, HOSAKERE;PITTLER, MARVIN, S. +DI;STEIMEL, HEINZ, OTTO