Three dimensional circuit modules

摘要

A three-dimensional circuit structure particularly useful in semiconductor memories consists of a stack of modules (10-1, 10-2, etc) mounted on a mother board (20) with connectors (50) between adjacent modules in the stack. The connectors mate with staggered and through terminals on the modules; the staggered terminals being used for circuits routed to destinations on specific modules and the through terminals for circuits routed to destinations on more than one module. Each staggered terminal includes a first connecting area on one side of a module connected to a second connecting area on the other side of the module with the first connecting area being opposite the second connecting area of a different staggered terminal. Connectors (50) connect opposing ones of the first and second connecting areas on adjacent modules.