发明名称 REDUCED PRESSURE SEALING PACKING METHOD
摘要 PURPOSE:To effect thermal bonding with ease under reduced pressure by providing a thermal bonding prevention piece at a part of an opening, applying thermal bonding operation to the opening and utilizing an unbonded part as a suction and exhaust passage for the air in a bag. CONSTITUTION:After putting clothes, bedclothes, etc., in a packing bag 1, a thermal bonding prevention piece 16 made of paper is attached to one side of an opening 4 of the bag 1 and then an opening sealing piece 9 is folded in two and applied to the opening 4 with a thermal bonding resin layer 11 of the piece 9 facing inward to cover the opening 4. If under such condition, thermal bonding is effected all over the piece 9 by applying an iron thereto, the part in which the piece 16 is interposed remains unbonded, following which the piece 16 is removed from the outside of the opening 4. As a result, a passage is formed across the interior and exterior of the bag 1, whereby a suction pipe of a vacuum cleaner is inserted into said passage to suck the air in the bag to establish reduced pressure in the bag. If thermal bonding is effected again on the cut-off mouth by means of an iron while the reduced pressure is being held, all area of the opening and the opening sealing piece are thermally bonded.
申请公布号 JPH04154516(A) 申请公布日期 1992.05.27
申请号 JP19900277513 申请日期 1990.10.16
申请人 NIPPON MATAI CO LTD 发明人 SHIMIZU YASUO
分类号 B65B31/04;B65B7/02;B65B51/10;B65D81/20 主分类号 B65B31/04
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