| 摘要 |
<p>PURPOSE:To prevent flow of paste on an island and prevent electrical short- circuiting, generation of cracks, etc., by forming a protruding bank or a groove line which sections larger than a contour of a chip on an upper surface of the island. CONSTITUTION:A conductive paste 3 is applied on an island at an inside region which is surrounded by a groove line 2 which is formed on an upper surface of an island 1a. When a semiconductor chip 4 is placed on this paste 3 and is lightly pressed, an extra paste is drop into the groove line 2 and is raised but does not flow to an edge of the island, thus preventing electrical short- circuiting with a lead 1a, air bubbles from being generated when molding a resin 6, and cracks from being generated.</p> |
