| 摘要 |
PURPOSE:To obtain a thermosetting resin composition having excellent heat resistance and mechanical strength, capable of readily molding and suitable for molding materials, laminate materials, etc., by blending a phenolic resin with a specific polyxylene glycol used as a curing agent. CONSTITUTION:100 pts.wt. phenolic resin is blended with >=2 pts.wt,. polyxylene glycol expressed by the formula ((n) is 1-100) having 300-4000 number-average molecular weight used as a curing agent to provide the objective composition. The composition has reduced volatile weight loss in molding and provides a molded article free from crack and shrinkage void. |
