| 摘要 |
PURPOSE:To prevent an electric short circuit in a process after a wire bonding operation and to eliminate a defect due to a wire by a method wherein, after the wire bonding operation, an insulating film is applied to the wire. CONSTITUTION:At an ordinary wire bonding operation, a bare bonding wire 2 on which an insulating film 1 has been formed is used and an IC chip 3 which has been fixed to a lead frame 4 is bonded. In this method, the surface of the wire 2 whose bonding operation has been finished is coated immediately with the insulating film 1. As a result, immediately after the bonding operation has been finished, a semiconductor device A including the chip 3 is sandwiched between a spray 6 and a vacuum suction apparatus 7, connected to a filter not shown in the figure, which have been installed in the upper part and the lower part. The semiconductor device A including the chip 3 is step-fed, and the insulating film 1 is applied to the wire 2 by using an insulating agent. At this time, an insulating-agent jet stream apparatus which executes the above operations collectively may be used without using the spray 6 and the like. Thereby, even sharp edges of the chip 3 and the frame 4 can be coated. |
