HALBLEITERPLAETTCHEN MIT LICHTEMITTIERENDER DIODENANORDNUNG UND HERSTELLUNGSVERFAHREN.

摘要

A LED array chip (6/26/46) comprising: a first semiconductor layer (16) having a p-type conduction; a second semiconductor layer (17) having a n-type conduction possessing a forbidden band width smaller than the first layer (16) and provided on the first layer (16), so as to form a semiconductor chip having a pn junction (8) at the interface with the first layer (16); the second layer (17) being divided into a first region (A) and a second region (B) by etching the second layer (17) until the pn junction (8), the first region (A) thereof being divided to form individual plural LEDs (22) of predetermined configuration, and the n-type layer (17) in the second region (B) being converted to the p-type layer as so to serve as a common region (13); individual electrodes (18) respectively provided to the surfaces of the LEDs (22); and a common electrode (19) provided to the common region (13), parts of the exposed surface of the p-type layer (16) corresponding to the LEDs ( 22) serving as light emitting surfaces (10). The LED array chip (6/26/46) is mounted on a printed circuit board (1) by directly bonding the individual electroeds (18 ) and the common electroed (19) to the corresponding terminals (7, 9) of the printed circuit (1).