| 摘要 |
<p>PURPOSE:To eliminate the generation of a break in the end parts of relief grooves without forming the parts reducing the strength at both end parts of the relief grooves by a method wherein the grooves are provided along the ridgeline of the recessed part in the tip part of a collet, the full length of the grooves is set smaller than that of the ridgeline and the upper edges of the openings of the grooves are continuously formed. CONSTITUTION:The whole collet 10 including its tip part is formed of a ceramic material and at the same time, relief grooves 9c are provided along the ridgeline of a recessed part 8, in which a semiconductor pellet 1a is abutted, the full length of the grooves 9c is set smaller than that of the ridgeline, the grooves 9c are formed in such a way that the upper edges of the openings of the grooves 9c are continued and each groove 9c is formed into the form of a long blind hole within the range of the ridgeline without penetrating the ridgeline. The collet 10 is formed by a method, wherein the ceramic material containing one kind or more selected from a group of Si3N4, ZrO2, Al2P3, SiC, Si-Al-O-N as its main component is liquefied, an injection molding is conducted and thereafter, the molded item is heated and sintered at a prescribed temperature and after a collet main body having the pyramidal recessed part 8 at its tip part is formed, the grooves 9c are formed by applying a laser beam along the ridgeline of the part 8.</p> |
