| 摘要 |
A clamping device for bonding machines used in manufacturing semiconductors including a clamp receiver, a rotatable lock key movable in a vertical direction on the clamp receiver, an air cylinder which pulls up and down the lock key, and a clamp which has a bonding window for bonding tool and an opening for the lock key passing through it. The clamp is mounted on the clamp receiver by letting the lock key pass through the opening, and then the lock key is turned so as not to accord with the opening. When the air cylinder is actuated, the lock key is pulled down and presses the clamp against the clamp receiver, securely positioning the clamp on the clamp receiver. Thus, the changing operation of the clamp is easily and quickly performed because the clamp can be removed by merely rotating the lock key and turning on and off the air cylinder.
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