| 摘要 |
1,223,156. Soldering. SPERRY RAND CORP. 9 April, 1968 [10 April, 1967], No. 16949/68. Heading B3R. [Also in Divisions H1 and H2] Circuit elements beneath a base 40, Fig. 7, are connected to an array of pins which carries a stack of printed circuit laminates 67-69 having some holes which fit the pins and have printed interconnections, other pins passing through over-sized holes. Each interconnection may be formed on one side only of a laminate or party on both, Fig. 6, with through-connections. Insulating sheets 7 separate the laminates. Preferably, each pin is connected to one laminate only. A solder ring is dropped over the pin on to the board through the over-sized holes of other boards and the stack heated.
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