发明名称 |
THERMOSETTING COMPOSITION FOR AN INTERPENETRATING POLYMER NETWORK SYSTEM |
摘要 |
A method for making a one package heat curable (i.e. thermosetting) composition which, on heating, forms a urethane/epoxy/silicone interpenetrating polymer network (IPN) system; one package heat curable compositions made by such a method; metal reinforcing patches, directly adherent to an oily metal surface such as an oily steel surface, comprising a sheet-like carrier having thereon such a one package heat curable composition in combination with a filler admixed therewith, said filler possibly including magnetic particles; a method for reinforcing metal which comprises applying thereto such a metal reinforcing patch and curing said heat curable composition at an elevated temperature to form a urethane/epoxy/silicone interpenetrating polymer network. |
申请公布号 |
CA1301981(C) |
申请公布日期 |
1992.05.26 |
申请号 |
CA19870528152 |
申请日期 |
1987.01.26 |
申请人 |
ESSEX SPECIALTY PRODUCTS, INC. |
发明人 |
RIZK, SIDKY D.;SHAH, NAVINCHANDRA B. |
分类号 |
C08G18/10;C08G77/458;C09J175/04 |
主分类号 |
C08G18/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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