发明名称 HOLLOW MOLDING OF POLYAMIDE
摘要 PURPOSE:To improve moldability, heat resistance, rigidity, etc., by using a polyamide resin comprising arom. dicarboxylic acid units derived from an arom. dicarboxylic acid component contg. terephthalic acid and diamine units derived from a linear aliph. diamine having an akylene group. CONSTITUTION:An arom. dicarboxylic acid component comprising 50-80mol% terephthalic acid and 20-50mol% arom. dicarboxylic acid other than terephthalic acid is converted into a halide and then polycondensed with a linear aliph. diamine having a 6-18C alkylene group in a homogeneous soln. to give a polyamide resin having an intrinsic viscosity (30 deg.C, in conc. sulfuric acid) of 1.1-3.0dl/g, a glass transition point of 60-130 deg.C, and a melt flow rate (ASTM D 1238, 350 deg.C, 2.16kg load) of 0.1-30g/10min. The resin is melted, compounded if necessary with a filler, another resin, etc., melt mixed at 310-370 deg.C, and blow molded to give the title molding.
申请公布号 JPH04153222(A) 申请公布日期 1992.05.26
申请号 JP19900276796 申请日期 1990.10.16
申请人 MITSUI PETROCHEM IND LTD 发明人 KANESHIGE NORIO;HASHIMOTO MIKIO
分类号 B29C49/00;B29K77/00;B29L22/00;C08G69/26 主分类号 B29C49/00
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