FALLING-OFF PREVENTING METHOD OF ELECTRONIC COMPONENTS

摘要

PURPOSE:To prevent the falling-off of an electronic component by applying a solder promoting agent which has an adhesion power and enhances the wettability of solder at a position where paste like solder is printed. CONSTITUTION:Cream solder 3 is printed on a wiring pattern 4 at a specified position where the top of the printed cream solder 3 is coated with a solder promoting agent 2. The solder promoting agent 2 is designed to have an adhesion power and enhance the wettability of solder. After the solder promoting agent 2 is coated, a chip electronic component 1 is immediately mounted at a specified position. More specifically, it is mounted in such a manner that an electrode 6 of the chip electronic component 1 may come into face contact with a part on the top of the solder 3. This construction makes it possible to hold the chip electronic component 1 on a board 5 to a satisfactory extent and thereby prevent the falling-off of components.