| 摘要 |
<p>PURPOSE:To improve solder wettability and realize sure connection of high bonding strength, by providing a preliminary heat radiation part, and previously heating a welding part before welding. CONSTITUTION:A preliminary heat radiation part 7 which generates radiation heat for locally heating a bonding pad 6 of a mounting substrate 5 is installed. Said part 7 is constituted of an infrared lamp 7a and a reflecting mirror 7b for converging infrared rays generated by the infrared lamp 7a. The bonding pad 6 is locally preliminarily heated by the preliminary heat radiation part 7, and an outer lead 3 of an IC chip 1 is connected with the bonding pad 6 by using a bonding tool 4. Thereby the bonding temperature at the time of bonding is made uniform, the solder wettability is improved, and the bonding force of the outer lead 3 and the bonding pad 6 is increased.</p> |
