发明名称 HIGH FREQUENCY PACKAGE
摘要 PURPOSE:To obtain a high frequency characteristic with high performance by providing a step to a grounding face of a base corresponding to a connection terminal and taking grounding at a rear side of the step. CONSTITUTION:A recessed step 16 is formed to a grounding face side of a base 10 opposite to a package grounding terminal 13 corresponding to the surrounding of the package grounding terminal 13. While a conductive elastic body 18 such as a conductive rubber is inserted between the step 16 of the base 10 and a mount body 17, the mutual package grounding terminals 13 are connected via a connection conductor 15. Thus, the step 16 of the base 10 is engaged elastically with the mount body 17 by utilizing an elastic force of the conductive elastic body 18. Thus, the connection performance is improved to enhance the impedance matching and sure contact is obtained and a high performance high frequency characteristic is obtained.
申请公布号 JPH04150203(A) 申请公布日期 1992.05.22
申请号 JP19900271568 申请日期 1990.10.09
申请人 TOSHIBA CORP 发明人 OTSUBO MASAO;TOMITA NAOTAKA
分类号 H01L23/12;H01P1/00;H01P3/08;H01P5/02 主分类号 H01L23/12
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