| 摘要 |
<p>PURPOSE:To standardize a pin grid array substrate by dividing the pin grid array substrate where a plurality of lead pins are systematically laid out. CONSTITUTION:A pin grid array substrate 2 is divided into several sections where lead pins 4 are systematically laid out on each divided pin grid array substrate. The pin grid array substrates 2 are laid out only at a required position. A first pad electrode 10 of a multilayer substrate 1 is connected with a second pad electrode by solder 3. This construction makes it possible to standardize mount methods and product designs.</p> |
