PRUEFEINRICHTUNG FUER BEIDSEITIGE KONTAKTIERUNG BESTUECKTER LEITERPLATTEN.

摘要

The testing device uses a needle adapter (Nau) with a specific configuration of contact needles (Kn1,Kn2) for contacting the underside of the circuit board (Lp) and a further needle adapter (Nao) with a different set of spring-loaded contact needles (Kn3,Kn4) contacting the upper surface of the circuit board (Lp). The two needle adapters (Nau,Nao) have opposing sets of buffers (Asu,Aso) between which the circuit board is clamped. The height of the lower buffers (Asu) is adjusted in two stages, to allow a 2-stage contact of the circuit board (4) using upper and lower contact needles (Kn1,Kn2;Kn3,Kn3) of two different lengths.