发明名称 METHOD FOR PICKUP OF SEMICONDUCTOR PELLET
摘要 <p>PURPOSE:To prevent damages such as scars and cracks in the processing to peel pellets off from a sheet by making a chuck collet and an organic resin sheet cause relative movements along the adhesive face of the organic resin sheet. CONSTITUTION:This method is to peel pellets 3 adhered on an organic resin sheet 4 off from the sheet 4 by using a chuck collet 1, thereby making the sheet 4 chucked by suction from a suction hole 7 provided in a suction frame 6. Suction from a suction hole 2 provided in the chuck collet 7 is started to evacuate the inside of the collet. Next, the parallel movement function of the chuck collet 1 is worked to cause the chuck collet 1 to move in parallel along the sheet 4, the peeling side wall 1a of the chuck collet 1 to contact the side face 3a of a pellet 3, and further the chuck collet 1 to move in parallel along the sheet 4, thereby generating slides between the sheet 4 and the pellet 3 to peel the pellet 3 off from the sheet 4.</p>
申请公布号 JPH04148547(A) 申请公布日期 1992.05.21
申请号 JP19900274279 申请日期 1990.10.12
申请人 DOWA MINING CO LTD 发明人 YASUDA KOKI;INOMATA HIRONARI
分类号 H01L21/677;B25J15/06;B65G49/07;H01L21/301;H01L21/52;H01L21/68 主分类号 H01L21/677
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