发明名称 WIRE BONDING INSPECTOR
摘要 PURPOSE:To obtain high inspection precision and to reduce the cost of an imager through use of only a lens with one kind of magnification by picking up images in several operations and by inspecting relative positional coordinates of wires obtained by each imaging in a unified absolute coordinate system. CONSTITUTION:When a wire 2 is too long to completely fit into one imaging area with dimensions Lx, Ly, a X-Y table 15 moves by control of a X-Y table controller 16 on the basis of instruction from a main controller 17 to move an imager 14 to a first imaging area 201, thereby picking up image for conversion into image signal. This image signal is subjected to image processing so that positional coordinates 31-33 of each point of the bonding wire 2 are determined. Conversion into coordinate positions 31a-31b in the absolute coordinate system is made on the basis of a semiconductor chip 1 in an image processing inspector 20. Thus, positional coordinates of all bonding wires 2 are unified into one absolute coordinate system with the result that wires 2 are inspected by the image processing inspector 20.
申请公布号 JPH04148544(A) 申请公布日期 1992.05.21
申请号 JP19900273771 申请日期 1990.10.12
申请人 TOSHIBA CORP 发明人 MIYAHARA UICHI
分类号 G01N21/88;G01N21/93;G01N21/956;G01R31/02;G01R31/28;G01R31/304;H01L21/00;H01L21/60;H01L21/66 主分类号 G01N21/88
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