| 摘要 |
<p>PURPOSE:To obtain stable and uniform electronic parts by printing a resistance paste or conductive paste (electrodes) on a substrate, baking in a vapor chamber at a low temperature to prevent bubbling, and then baking in a vapor chamber again at a higher temperature for hardening. CONSTITUTION:A resistance or conductive paste printed on a substrate in order to form a resistor is baked in a vapor chamber with a low temperature to prevent the formation of bubbles on the film surface caused by bumping from the heat, for example a vapor chamber 1 with an inert solvent that has a boiling point of 102 deg.C, and is then baked a second time in a vapor chamber at a higher temperature for hardening, for example a vapor chamber 2 with an inert solvent that has a boiling point of 215 deg.C. This method can also be used for the baking of conductive paste for membrane switches or copper paste and other polymer thick film pastes for EMI shields. Also, when a cooling element using the cooling coil 6 is established between the vapor chamber 1 and vapor chamber 2, it is possible to reduce the amount of inert solvent used. By conducting all heating in the vapor chambers, uniform and stable temperatures are achieved and baking can be completed in a short time with excellent heating efficiency.</p> |
