摘要 |
Soln. (I) is used as a surface-protection material for colour filters for light-receiver elements or display elements; (I) contains a low temp.-curable silicone compsn. contg. (A) a low-temp.-curable OH-terminated organo-Si chain polymer with formula (II), and (B) 0.25-2.5 wt.% aromatic diazido or azido cpd. (In (II), R1, R2= Ph, Me or alkenyl, of which 2.5-10% (w.r.t. n) are alkenyl gps.; n= a whole number) such that (II) has mean mol. wt. 75,000-250,000. (A) is specifically polyphenyl-, polyallylphenyl-, polymethylvinyl-, polyallylmethyl-, polyethylvinyl- or polyallylethyl-silsesquioxane and (B) is a 3,3'- or 4,4'-diazido- diphenylsulphone or a 2,6-di-(azidobenzal) -cyclohexanone; solvent in (I) is aromatic hydrocarbon (e.g. anisole, xylene, benzene), ketone (e.g. MIBK, acetone) ether (e.g. THF, isopropyl ether), ethylcellosolve, NMP, N,N'-DMA or a mixt. thereof; pref. (I) (soln. IA) contains (A) OH-terminated polyphenyl -silsesquioxane with mol. wt. 150,000 in which 3% of the side chains are vinyl gps. and (B) 1.8 wt.% 3,3'-diazido-diphenylsulphone (B1), pref. with an amt. of methoxybenzene solvent so that (I) contains approx. 15 wt.% (A). Also claimed is prodn. of the protective layer by (a) applying soln. (I) to a colour filter, (b) coating the layer obtd. with a positive varnish, (c) curing the varnish with laser light to form a masking pattern, (d) etching with a solvent mixt. contg. methoxy-benzene and/or xylene using the pattern as a mask, and (e) removing the masking agent with a known remover and then curing the silicone material at not above 270 deg.C for not above 45 mins.; for pref. soln. (IA) stage (a) involves drying for 30 mins. at 80 deg.C and 30 mins. at 150 deg.C to give a layer up to 4 microns thick, positive layer in (b) is up to 3 microns thick, vol. ratio PhOMe:xylene in stage (d)= 1:3, and the prod. is cured stage (e) for 30 mins. at 260 deg.C. USE - (I) is used for the above applications.
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申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO, JP |
发明人 |
ADACHI, HIROSHI;YAMAMOTO, SHIGEYUKI, AMAGASAKI, HYOGO, JP |