发明名称 RESISTOR BUILT-IN MULTILAYER BOARD
摘要 <p>PURPOSE:To inexpensively obtain a resistor containing type multilayer board having microscopic resistance films in a high density accurately by forming a conductor pattern of a thin conductive film formed of a metal organic paste material, and forming an insulating layer of a polyimide film. CONSTITUTION:A thin conductive film of metal organic paste is patterned by a screen printing method of a photoetching method as a conductor pattern 3 on an insulating board 1, a resistance film 2 made of thick film resistance paste is further printed and baked to be formed on the pattern 3, and the film 3 is laser trimmed to regulate its resistance. Then, a polyimide resin film 4 is patterned as an insulating layer except a viahole 4' from above by a screen printing method or a photolithography method and baked to be formed. Thereafter, after a Cr film and a Cu film are sequentially formed as thin conductor films 5 on the entire upper surface of the film 4, they are patterned by a photoetching method, and an Ni film having about 2mum of thickness is formed thereon. Further, a polyimide resin film, a thin conductor film are sequentially laminated by the above method to be multilayered.</p>
申请公布号 JPH04147695(A) 申请公布日期 1992.05.21
申请号 JP19900270586 申请日期 1990.10.11
申请人 MITSUBISHI MATERIALS CORP;KAMAYA DENKI KK 发明人 ROKUSHA TAKEO;HIRANO TATSUKI
分类号 H01C7/00;C09D5/24;H05K1/16;H05K3/46 主分类号 H01C7/00
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