| 摘要 |
<p>PURPOSE:To prevent chipping of a wafer and prevent short-circuit by adhering a wafer sheet on the plane of the wafer, forming a kerf on the opposite plane and cutting the semiconductor wafer by grinding the remaining part of the kerf by a blade on which super fine abrasive grains are adhered. CONSTITUTION:A wafer sheet 8 is adhered on a semiconductor wafer 7 and a frame 9 on which the semiconductor wafer 7 is fixed is sucked on a vacuum table 10. A kerf is formed by the depth which permits to leave the wafer by 10mum-100mum using a blade 3a which is a cutting means. Then, the remaining part of the kerf is cut by jetting abrasive grain liquid on a blade 3 so as to cut the semiconductor wafer 7 completely. Namely, the jetting of the abrasive grain liquid on the blade 3 permits colloidal silica in the abrasive grain liquid to be electrodeposited on the blade 3, and the cutting under such condition reduces chipping and burrs caused by the crossing of the dicing groove line with the opposite plane line.</p> |
