发明名称 METHOD OF RELEASING MULTI-LAYERED MOLDING
摘要 PURPOSE:To facilitate mold releasing and take-out of a multi-layered molding by maintaining the end peripheral part of a first material adhering to a lower mold by a clamping device, and separating a second material and an upper mold, and then releasing the sticking of the first material to the lower mold by means of the clamping device. CONSTITUTION:A mold releasing agent 4 is used in a small quantity and applied onto an upper mold. On a lower mold 1, a semi-molded first material 3 is mounted and the four sides thereof are clamped at appropriate distances. For a clamping device 20, a manually operating spring buckle is adaptable, however, a clamping device utilizing a hydraulic cylinder 30 and a rink can also be used therefor. While keeping the clamping intact, mold clamping, the injection of the second material 6, and mold opening are effected therein. At the time of mold opening, even the welding of the second material 6 is partially performed with respect to the inner wall of an upper mold, since the adhesive forces between the first and second materials are greater than this, the second material is left on the lower mold together with the first material clamped, therefore, the operator P can remove a multi-layered molding 10 without changing his position.
申请公布号 JPH04147811(A) 申请公布日期 1992.05.21
申请号 JP19900274143 申请日期 1990.10.11
申请人 DAIKYO INC 发明人 TAKENAKA TATSUYA;TAKASHINA RYUJI;SAEKI SUSUMU
分类号 B29C39/36;B29C39/10;B29K105/04;B29L9/00 主分类号 B29C39/36
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